Open Compute Project* – Hyperscale Computing Open for Business and Gaining Momentum

It was an honor to address the community at the Open Compute Project* (OCP) Summit 2018. This year’s theme is “Open for Business” and I’m thrilled to share our progress making the latest tech available to all. Community membership and adoption are at their highest levels. We see a vision being realized for open sourcing hardware, platforms, and software. As an OCP founding member since 2011, we’ve been an integral part of this voyage, helping the foundation work together and share best practices. We depend on each other to drive innovation, deliver products, and deploy infrastructure that underlies the services that support the digital economy.

We’re now in a data-centric world. This fundamentally shifts the way we approach tech development and innovation. We’ve taken a “data first” approach focused on full platform solutions that span the breadth of software, compute, network, and storage. Meeting operators’ needs for new service delivery requires infrastructure, customization, and optimization. So as we look to the world of hyperscale, new projects are required to take OCP deployment to the next level of adoption.

At Intel, we’re investing in the project that we believe will make an impact. To drive compute capability, we’ve updated the Tioga Pass and Mt. Olympus designs to support the latest Xeon® Scalable processor coupled with the latest SSDs enabling OCP platforms to reach new system performance and density highs.

New density-optimized storage designs such as Yosemite with Glacier Point leverages our latest Xeon-D 2100 SOC to provide up to 72 cores or 32 TB per U in a rack. For the network, the new OCP NIC 3.0 specification provides more bandwidth and power headroom for OCP platforms by supporting higher speed scalable Ethernet as well as programmable Smart NICs. At last year’s OCP Summit we announced a breakthrough in connectivity by productizing 100 Gigabit per second optical modules compliant to the CWDM4-OCP specification. These OCP optical modules are now released and shipping in volume to support 100G data center networking deployments. The industry is now focused on the next-generation of 12.8 Terabit per second switches and networking infrastructure, requiring even higher-bandwidth optics up to 400 Gigabits per second. This year we will demonstrate the first 400G optics product, 400G CWDM8. In the area of storage, we are announcing the availability of the M.2 form factor of Intel® Optane™ SSDs enabling NVMe scale out storage using the Tioga Pass with Ava system. We are investing in developing innovative, performant, low cost NVM. To make SSDs more flexible and scalable, we’re contributing to Project Denali which will use a combination of Intel Optane technology and Intel 3D NAND to address the storage challenges of hyperscale data centers.

This all comes together with Intel® Rack Scale Design (Intel® RSD), an industry-aligned architecture for composable, disaggregated infrastructure, built on industry standards. In the second quarter, we will broaden our feature set to add support for NVMe over Fabrics with the release of Intel RSD 2.3. As we journey toward the realization of a fully composable and disaggregated data center infrastructure, future releases will add features for resource pooling and management beyond rack power, cooling, and storage to include memory and accelerators and provide support for Intel’s latest technologies, like Intel Optane SSDs and Intel persistent memory.

It’s exciting to see the growing number of OCP-compliant systems running Intel Rack Scale Design on display at Intel and partner booths at OCP Summit.

Learn more about Intel Rack Scale Design here.


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