Silicon Photonics Trajectory Accelerates

The optical communications industry is set to meet again for the ECOC Exhibition, this year in Dublin. It’s a great opportunity for colleagues to come together and plan for the future and collaborate over Intel’s latest work in silicon photonics. Intel continues to ramp its 100G optical transceivers and looks forward to 400G production in 2020. At the show we will announce the addition of 200G products to our photonics portfolio. These new 200G transceivers are sampling to major customers now and will begin production in the first half of 2020.

Silicon Photonics is a combination of two of the most important inventions of the 20th century—the silicon integrated circuit and the semiconductor laser. It is not an exaggeration to say that silicon photonics will change the infrastructure of high-speed network communications in the data center and beyond in foundational ways.

Manufacturing at Scale

Intel® Silicon Photonics integrates the laser into silicon, creating significant optical performance and size advantages. Intel Silicon Photonics also present many advantages over traditional optics through wafer-scale industry packaging and assembly techniques that readily enable mass manufacturing.

We started 100G data center production shipments of Intel Silicon Photonics in 2016, exceeded a 1Million units per year run-rate last year, and have now reached a 2Mu/year run-rate. We are also ramping our production capacity to support next year’s data center deployments at 200G and 400G.

Part of a Bigger Picture

Intel is the only company with such a broad range of connectivity solutions, including Ethernet switch silicon following the acquisition of Barefoot Networks earlier this year, Intel® Omni-Path Architecture (Intel® OPA) fabric for demanding HPC and AI environments, and our new Intel® Ethernet 800 Series, which includes features like Application Device Queues (ADQ), enhanced Dynamic Device Personalization (DDP), and support for all three Ethernet-based NVME over Fabrics storage transport protocols: iWARP* and RoCE v2* Remote Direct Memory Access (RDMA), and NVMe over TCP accelerated by ADQ.

At 100GbE, the Intel Ethernet 800 Series pairs nicely with our robust line of 100G SiPh transceiver products for applications which connect directly to the Network Interface Card (NIC).  Such a broad range of products from one company enables customers to put together end-to-end solutions more quickly and seamlessly with the industry exposure and expertise that only Intel can bring.

ECOC Exhibition 2019

All three silicon photonics speeds (100G, 200G, and 400G) will be on display at ECOC Exhibition 2019 connected to a Barefoot Networks Tofino 2 Ethernet ASIC-based switch in the Intel booth (#262).

If you’re attending ECOC Exhibition 2019, don’t miss Intel’s presentations at the event:

  • “Integrated Photonics Workshop” with Robert Blum on Sunday, September 22 from 9:30am-11:00am
  • “Integrated Silicon Photonics for Future Datacenter Applications” with Thomas Liljeberg on Tuesday, September 24 from 10:55am-11:25am
  • “Silicon Photonic Components for 400 Gb/s Transceivers” with Yuliya Akulova on Tuesday, September 24 from 1:30pm – 2pm
  • “High-Volume applications of 3-d sensing in consumer and automotive markets” with Robert Blum on Wednesday, September from 11:30am-12pm

Finally, be sure to come by the Intel booth (#262) to see how we’re leveraging our technology and performance leadership to expand into markets beyond the data center and enabling the future of 5G services. For more information, visit

Published on Categories Data Center NetworkingTags , , ,
Hong Hou

About Hong Hou

Dr. Hong Hou is the Corporate Vice President of the Data Platforms Group at Intel. Hong joined Intel in 2018 as Vice President of Data Center Group and General Manager of the Silicon Photonics Product Division. Prior to Intel, Hong has served as Executive Vice President and Chief Technical Officer for Fabrinet, Chief Operations Officer of AXT Inc., and as President, Chief Executive Officer and a member of the board of directors of Emcore Corporation. Early in his career, Hong conducted research at AT&T Bell Laboratories and Sandia National Laboratories on semiconductor materials and devices. Hong holds a Ph.D. in Electrical Engineering from the University of California at San Diego.